Description
PACK OF 4000 PIECES
The C0603C180J5GAC is a high-quality SMD (Surface-Mount Device) ceramic capacitor designed for use in a wide range of electronic applications. Encased in a 0603 package, one of the smallest standard sizes available for SMD components, this capacitor features a capacitance of 18 picofarads (pF) and a voltage rating of 50 volts. It is suitable for medium voltage applications where precision and compactness are key.
Key Features and Benefits:
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Capacitance (18pF): The 18 picofarad capacitance is particularly useful in high-frequency and RF (Radio Frequency) applications, as well as in timing and tuning circuits, where small, precise capacitance values are critical for circuit functionality.
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Voltage Rating (50 Volts): With a 50-volt rating, this capacitor is capable of handling medium voltage applications, making it versatile for use in various electronic devices and circuits.
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Package (0603 SMD): The 0603 package size is incredibly compact, allowing for high-density component placement on printed circuit boards (PCBs), which is essential in modern electronic devices where space is at a premium.
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Model (C0603C180J5GAC): The model number C0603C180J5GAC accurately defines the capacitor's specifications, ensuring the correct choice for compatibility and optimal performance in electronic designs.
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Applications: This capacitor is widely used in consumer electronics, telecommunications devices, automotive systems, and other fields where efficient use of space and reliable capacitor performance are necessary.
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Features: Known for its stability and reliability, the C0603C180J5GAC ceramic capacitor is designed to provide consistent performance across various conditions. Its SMD design is conducive to automated manufacturing processes, enhancing production efficiency and consistency.
In summary, the C0603C180J5GAC ceramic capacitor, with its 18pF capacitance and 50V voltage rating, is an excellent choice for applications requiring a compact, efficient, and reliable capacitive component. Its small 0603 package size makes it particularly suitable for modern electronic designs where space efficiency and high component density are key considerations.
